Escape Velocity

Overview / Domain

Enabling technologies

Cross-cutting technologies many others depend on: cryogenics, power electronics, photonics, sensors and precision manufacturing.

Readiness on Technology readiness levelSDG: Industry, innovation and infrastructure

Moderators: none yet: volunteer

Electronics that operate at cryogenic temperatures next to the qubits and generate control signals and read out results, replacing one line from room temperature per qubit.

0 open gaps · not assessed

Cryostats that cool devices to a few millikelvin and remove the heat that wiring, amplifiers and control electronics add at that temperature.

Cooling power: 0.002 W · 0 open gaps · not assessed

Cooling that removes the heat of dense chips and stacked dies at the device, at heat fluxes well above those of air and cold-plate cooling, in a form that fits in a package and can be made in volume.

Heat flux removed: 10⁷ W m⁻² now, target 10⁸ W m⁻² (1.0 orders of magnitude) · 0 open gaps · TRL 4 (4 of 9)

Many optical components, such as waveguides, modulators, lasers and detectors, made together on one chip with low loss at a cost that allows volume.

Waveguide propagation loss: 1.77 dB m⁻¹ · 1 open gap · not assessed

Converters and switches that move megawatts to gigawatts at high efficiency and power density, from the grid to magnets, lasers and data centres.

0 open gaps · not assessed