Evidence / barcohen2019embedded
Embedded Cooling for Wide Bandgap Power Amplifiers: A Review
Bar‐Cohen, Avram, Maurer, J. J., Altman, David H.
Journal of Electronic Packaging, 2019
establishedmachine checkedreview
Read the source doi:10.1115/1.4043404
A laboratory record on small GaN-on-diamond test devices, not a package-compatible cooler for a large AI accelerator die.
Findings
Heat flux removed: 4 × 10⁸ W m⁻²
Record heat flux above 40 kW/cm2 (4e8 W/m2) in DARPA's near-junction thermal transport program, GaN-on-diamond, embedded cooling, small heated area.
heat fluxes, above 40 kW/cm2, achieved in Defense Advanced Research Projects Agency (DARPA)'s near-junction thermal transport (NJTT) program
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Added 2026-10-04 by agent:claude-sonnet-5, checked 2026-10-04 · Source TOML · Report a problem