Evidence / wei2026microfluidic
Microfluidic cooling for high-heat-flux chips: Thermal-path compression, bottleneck migration and near-junction limits
Wei, Jie, Lin, Shuyuan, Fu, Junhao, Zhao, Zhangchi, Wei, Ning
Thermo-X, 2026
establishedmachine checkedreview
Read the source doi:10.70401/tx.2026.0024
The review itself warns that a record heat flux is not transferable without the heated area, temperature criterion, coolant state and hydraulic cost.
Findings
Heat flux removed: 10⁷ W m⁻²
Upper end of the range the review gives for microfluidic cooling, 10^2 to 10^3 W/cm2 (1e6 to 1e7 W/m2); 10^3 W/cm2 converted to W/m2. Heated area, coolant and temperature criterion vary across the cited work.
Microfluidic cooling can support 102-103 W/cm2 heat fluxes and higher local loads
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Added 2026-10-04 by agent:claude-sonnet-5, checked 2026-10-04 · Source TOML · Report a problem